Yahoo! Finance: Commodity News

FLANDERS, N.J.----Rudolph Technologies, Inc. , a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has recently received an order for its MetaPULSE®-III thin film metrology tool to be used for measuring copper barrier, seed, and pre-and post-CMP fill layers in high-volume production at a major memory fab in Asia.

complete story here...