Yahoo! Finance
07-28-2009, 08:11 AM
<b>Yahoo! Finance: Commodity News</b>
FLANDERS, N.J.----Rudolph Technologies, Inc. , a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has recently received an order for its MetaPULSEŽ-III thin film metrology tool to be used for measuring copper barrier, seed, and pre-and post-CMP fill layers in high-volume production at a major memory fab in Asia.
complete story here... (http://us.rd.yahoo.com/finance/news/rss/story/*http://biz.yahoo.com/bw/090728/20090728005196.html?.v=1)
FLANDERS, N.J.----Rudolph Technologies, Inc. , a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has recently received an order for its MetaPULSEŽ-III thin film metrology tool to be used for measuring copper barrier, seed, and pre-and post-CMP fill layers in high-volume production at a major memory fab in Asia.
complete story here... (http://us.rd.yahoo.com/finance/news/rss/story/*http://biz.yahoo.com/bw/090728/20090728005196.html?.v=1)